Description
Overview
Chem-Wik Rosin is especially designed for today’s heat sensitive electronic components. The lighter mass, pure copper braid construction allows for better thermal conductivity, even at low temperatures. Chem-Wik Rosin responds as much as 50% faster than conventional desoldering braids. This design minimizes overheating and requires less “contact” pressure for greater operator control. All sizes are coated with a Type “R” organic flux system.
Features
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Chem-Wik Rosin 5′ spools packaged in ESD-safe static dissipative bobbins
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Requires little or no post solder cleaning, no corrosive residues
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Optimized weave design for faster wicking and heat transfer
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Halide free
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Coated with ultra high purity, noncorrosive Type R rosin flux
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Quickly and thoroughly removes solder
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Fast wicking action protects components from harmful heat damage
Applications
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Chem-Wik Rosin desoldering braid safely removes solder from:
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Thru-hole Components
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Surface Mount Device Pads
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BGA Pads
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Micro Circuits
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Terminals
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Lugs and Posts
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Identification Script
Specifications
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MIL-F-14256F Type R
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NASA STD-8739.3 Soldered Electrical Connections
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ANSI/IPC J STD-004, Type ROL0
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DOD-STD-883E, Method 2022
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#3 green, 0.075″/1.9mm width, 25 feet/7.6m on spool
Resources
Technical Data Sheet
Safety Data Sheet

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